CCPMC

[Ivor Bowden <ivor@peritek.com>]

Hi,

In regards to Conduction Cooled PMC the preliminary specification
says that the thermal interface is not to be connected to circuit
ground. I'm designing a CCPMC board that uses a BGA with a thermal
ball array that is grounded. I'm wondering if I should use a
thermal plane next to a ground plane or if I should make the
thermal interface ground and rely on thermal insulator pads.

Could anyone share their thoughts and / or experiences in this matter?

Thanks,

-Ivor

Ivor Bowden
Peritek Corp
5550 Redwood Road
Oakland, CA 94619 USA
phone: (510) 531-6500
FAX: (510) 530-8563
url: www.peritek.com
email: ivor@peritek.com