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In regards to Conduction Cooled PMC the preliminary specification
says that the thermal interface is not to be connected to circuit
ground. I'm designing a CCPMC board that uses a BGA with a thermal
ball array that is grounded. I'm wondering if I should use a
thermal plane next to a ground plane or if I should make the
thermal interface ground and rely on thermal insulator pads.
Could anyone share their thoughts and / or experiences in this matter?
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