PCIe® Base 3.1 Specification
PCIe Card Electromechanical 3.0 Specification
The PCI-SIG is pleased to release the PCI Express® Base 3.0 specification. This document culminates a multi-year development effort by members of the PCI-SIG.
This specification describes the PCI Express architecture, interconnect attributes, fabric management, and the programming interface required to design and build systems and peripherals that are compliant with the PCI Express Specification.
The goal is to enable such devices from different vendors to inter-operate in an open architecture. The specification is intended as an enhancement to the PCI™ architecture spanning multiple market segments; Clients (Desktops and Mobile), Servers (Standard and Enterprise), and Embedded and Communication devices. The specification allows system OEMs and peripheral developers adequate room for product versatility and market differentiation without the burden of carrying obsolete interfaces or losing compatibility.
PCI Express Base 3.1 Specification
PCI Express Base 3.0 Specification
Be sure to check the list of PCI Express ECNs and Erratum for the latest updates for these specifications.
PCI Express Card Electromechanical 3.0 Specification
The PCI Express Card Electromechanical (CEM) 3.0 specification serves as a companion document to the PCI Express Base 3.0 specification.